A dual in-line package (DIIPP) is a cost-effective solution for high volume manufacturing of semiconductors. It consists of two separate on-chip connection points. This helps to reduce the physical footprint, increase electrical performance and shorten final test times. In this blog, we will explain how you can choose your DIP Assembly for the PCB board.
What is Dual In-line Package?
Dual in-line package (DIIPP) is a design approach for high volume manufacturing where two separate connections are made to the chip. These two connections are placed on the same substrate layer. This allows to increase the electrical performance, reduce the physical footprint and shorten the test time. DIIPP is mainly used for low to medium volume manufacturing of semiconductors. However, DIIPP can be used in any manufacturing environment.
The main advantages of DIIPP are as follows. – Reduced area and footprint – DIIPP design reduces the area and footprint of the chip by 50% compared to a single in-line package. – Reduced cost – DIIPP design results in reduced costs including die, substrate, and interconnect costs. – Faster test cycle – Test time is reduced because there are less propagation delay components on the PCB. – Improved reliability – Reliability is improved because the PCB is less susceptible to damage which can cause errors in the system. – Improved power efficiency – Increased power efficiency of the system due to smaller size of the chip. – Reduced manufacturing time – Manufacturing time is reduced due to smaller area of the chip.
PCB board types for DIIPP
DIIPP is mainly used for low to medium volume manufacturing of semiconductors. You can use DIIPP for any semiconductor based PCB type. However, for DIIPP to be successful, the PCB must meet certain criteria. For DIIPP to work, the PCB must have the following features. – Wide capacitance trace width – Wide capacitance trace width reduces the transmission delay of the system. – Wide resistance trace width – Wide resistance trace width reduces the power loss in the traces. – Low resistance design – Resistance of PCB tracks should be low so that they have low conductivity and low resistance. – Low inductance design – PCB tracks should have low inductance so that they have low conductivity and low inductance.
Advantages of DIIPP
The main advantages of DIIPP are as follows. – Reduces PCB area – Area of PCB is reduced due to the two separate connections to the chip. – Shorter test process – Test time is reduced because there are less propagation delay components on the PCB. – Improved reliability – Reliability is improved because the PCB is less susceptible to damage which can cause errors in the system. – Increased power efficiency – Increased power efficiency of the system due to smaller size of the chip. – Reduced manufacturing time – Manufacturing time is reduced due to smaller area of the chip.
Disadvantages of DIIPP
The main disadvantages of DIIPP are as follows. – Increased PCB complexity – PCB tracks are more complex due to two separate connections to the chip. – Increased design time – Design time is increased due to two separate connections to the chip. – Additional interconnects – PCB tracks need additional interconnects due to two separate connections to the chip. – Enhanced rework – PCB tracks are more susceptible to damage and therefore require more rework. – Increased cost – Chip is more expensive due to two separate connections to the chip. – Less trace width – Trace width is reduced due to two separate connections to the chip.
Conclusion
Dual in-line package (DIIPP) is a cost-effective solution for high volume manufacturing of semiconductors. It consists of two separate connections. This helps to reduce the physical footprint, increase electrical performance and shorten final test times. In this blog, we will explain how you can choose your dual in-line package for PCB board. DIIPP is mainly used for low to medium volume manufacturing of semiconductors. However, DIIPP can be used in any manufacturing environment. PCB board types for DIIPP are listed above.
